TY  - JOUR
AB  - This paper outlines methods and results of wetting, leaching and adhesion analyses on copper thick film conductors over alumina and multilayer glasses after different processing conditions. The intention is to provide a better background for evaluating and optimising materials and processing conditions in copper thick films and working out quick, reliable and quantitative methods for better characterisation of copper conductors in production. For these reasons the following methods were used: (a) wetting and leaching analyses with a scanning wetting balance, working in nitrogen, (b) pull tests with solder contacts on copper thick film conductors after soldering, ageing and thermal cycling, and (c) some additional surface analyses (REM, EDX, Auger) for a better understanding of copper pastes and their material interactions, when processed under different conditions. The results are summarised under three general aspects: surface structure and wetting of copper thick films, wetting and leaching of various copper thick films after different processing conditions, and finally the influence of different wetting properties of such surfaces on the solder adhesion strength after soldering, ageing and thermal cycling. The results give good insight into the various interactions of copper thick films with their substrate materials and confirm the ability of the described wetting and leaching analyses for these purposes.
VL  - 3
IS  - 2
SN  - 1356-5362
DO  - 10.1108/eb044227
UR  - https://doi.org/10.1108/eb044227
AU  - Leibfried W.
PY  - 1986
Y1  - 1986/01/01
TI  - Wetting, Leaching and Solder Adhesion of Copper Thick Film Conductors on Alumina and Multilayer Glasses
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 24
EP  - 37
Y2  - 2024/09/18
ER  -