The Measurement of the Solderability of Metallic Pads on Thick‐film Substrates

Abstract

A method for assessing the solderability of thick‐film substrates is described. An appropriate quantity of solder, with a soldering flux, is applied to the land to be tested and is melted under precisely defined conditions. After solidification of the solder, the diameter of the base of the droplet is measured. The value of the wetting angle, which is a measure of the solderability, can be read from a calibration graph. An analysis of variance has been performed to evaluate the reproducibility of the test method used.

Citation

Verguld, M.M.F. (1986), "The Measurement of the Solderability of Metallic Pads on Thick‐film Substrates", Microelectronics International, Vol. 3 No. 2, pp. 16-19. https://doi.org/10.1108/eb044225