For thick film resistor materials with low sheet resistivity (less than 10 ohm/□) sheet resistivity increases with decreasing resistor length, when terminated with Pd alloy based conductors. This is due to the reaction of palladium from the thick film conductor and bismuth ruthenate (Bi2Ru2O7), which is the active phase in thick film resistor material. The experimental results indicate the formation of Pd/Bi solid solution on the interface between the conductor and resistor. Because of its higher specific resistivity, this layer functions as an additional source of resistivity.
Hrovat, M., Jan, F. and Kolar, D. (1986), "The Interaction Between Thick Film Conductors and Low Ohmic Resistors", Microelectronics International, Vol. 3 No. 2, pp. 14-15. https://doi.org/10.1108/eb044224Download as .RIS
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