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Drawbridging of Leadless Components

R.J. Klein Wassink (Centre for manufacturing Technology (CFT), Nederlandse Philips Bedrijven BV, Eindhoven, The Netherlands)
M.M.F. Verguld (Centre for manufacturing Technology (CFT), Nederlandse Philips Bedrijven BV, Eindhoven, The Netherlands)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 1986

39

Abstract

Drawbridging or Stonehenge Effect of leadless components (i.e., the standing up on their end faces) has been investigated. An explanation is offered based on a straightforward theoretical model considering surface tension, sustained by a great amount of experimental evidence. The phenomenon is strongly associated with condensation reflow soldering, whereas the dimensions of the metallisation at the underside of the leadless components and the size of the solder lands on the board are major influencing factors. Practical hints are given to overcome the problem.

Citation

Klein Wassink, R.J. and Verguld, M.M.F. (1986), "Drawbridging of Leadless Components", Microelectronics International, Vol. 3 No. 1, pp. 18-24. https://doi.org/10.1108/eb044209

Publisher

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MCB UP Ltd

Copyright © 1986, MCB UP Limited

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