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Polyimide Protection of Thin Film Chip Resistors

H. Diletti (Balzers AG, Balzers, Liechtenstein)
J.R. Noser (Balzers AG, Balzers, Liechtenstein)
G.J. Sele (Balzers AG, Balzers, Liechtenstein)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 1985

30

Abstract

In hybrid technology, components (e.g., ICs, capacitors, resistor chips) are mounted onto a thin or thick film circuit. Bare chip resistors are usually incorporated into hermetically sealed hybrid circuits (die and wire bonding). Encapsulated chip resistors or chip resistors with a protective layer are required in the case of non hermetic sealing (flip chip soldering, surface mounting). The electrical performance of resistor chips with and without polyimide protective coating was investigated and is compared. This investigation was performed on NiCr based and Ta2N thin resistive films.

Citation

Diletti, H., Noser, J.R. and Sele, G.J. (1985), "Polyimide Protection of Thin Film Chip Resistors", Microelectronics International, Vol. 2 No. 4, pp. 28-31. https://doi.org/10.1108/eb044199

Publisher

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MCB UP Ltd

Copyright © 1985, MCB UP Limited

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