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Accuracy of Integrated Voltage Dividers in Plastic Packaged Linear ICs

C. Cognetti (SGS Microelettronica SpA, Milan, Italy)
F. Simonini (SGS Microelettronica SpA, Milan, Italy)
F.F. Villa (SGS Microelettronica SpA, Milan, Italy)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 1985

19

Abstract

This study attempts to quantify the loss of accuracy that arises after packaging and during the life of the IC device. To identify a solution to the problem of mismatch in voltage dividers, the characterisation of the amount of stress associated with commercially available moulding compounds was performed by means of silicon integrated strain gauges. In addition, the influence of the voltage divider lay‐out was measured with a specifically designed test pattern. The possibility of producing circuits with an accuracy level better than 0·1% without trimming was demonstrated.

Citation

Cognetti, C., Simonini, F. and Villa, F.F. (1985), "Accuracy of Integrated Voltage Dividers in Plastic Packaged Linear ICs", Microelectronics International, Vol. 2 No. 4, pp. 19-23. https://doi.org/10.1108/eb044196

Publisher

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MCB UP Ltd

Copyright © 1985, MCB UP Limited

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