Use of Adhesives in Surface Mounting

Abstract

Increasing interest in surface mount technology has led to a growth in the use of adhesives for attachment of SMDs. This paper reviews the properties of an adhesive which make it suitable for use in attachment of SMDs. Visibility, rheology and cure speed are of primary importance but the need for one‐part stable materials is stressed. The existing adhesives offered are generally based on epoxy or acrylic technology. Though these products are effective in attachment they have many features which make them less than ideal, e.g., mixing of multi‐component systems, high cure temperature, etc. One‐part acrylic anaerobic adhesives offer the benefit of low cure temperatures with good strength and product stability. Curing data, adhesive properties and cured polymer properties are reported for a new acrylic anaerobic adhesive which has been specifically designed for attachment of SMDs to substrates.

Citation

Grant, S. and Wigham, J. (1985), "Use of Adhesives in Surface Mounting", Microelectronics International, Vol. 2 No. 4, pp. 15-16. https://doi.org/10.1108/eb044194