Large Substrate Thick Film Printing and Handling

Abstract

Output rates with multicircuit printing techniques on different sizes of substrate are examined. Hand load/unload is then compared with the autofeed systems now becoming available for larger sizes. High yield is shown to be more important than high cycling rates, and increasingly so the larger the substrate. The factors important to achieving high yield are examined, and some of the improved techniques for substrate handling and registration are described.

Citation

Phippard, C. (1985), "Large Substrate Thick Film Printing and Handling", Microelectronics International, Vol. 2 No. 3, pp. 9-11. https://doi.org/10.1108/eb044179