Surface Mount Technology Setting Up a Surface Mount Facility

Abstract

This paper presents the manufacturing methods used in the assembly of electronic circuits with surface mount components on planar printed wiring circuits. The manufacturing process flow is explored as a function of the design of the circuit as well as the selection of surface mount components. Equipment evaluation criteria are presented along with facilities' requirements in the area of utilities and floor space.

Citation

Rowe, G.L. (1985), "Surface Mount Technology Setting Up a Surface Mount Facility", Microelectronics International, Vol. 2 No. 2, pp. 27-34. https://doi.org/10.1108/eb044175