Packaging of Dot‐matrix Electroluminescent Display Module

Abstract

Demanding technical requirements of thin film electroluminescent display modules and hard competition in electronic display markets set boundaries for the setting of goals in the development of an extremely thin display module. To meet the targets the problems of electronic packaging concepts had to be considered from the point of view of total optimisation. As a result, a packaging concept was developed which had an influence on all design decisions starting from the end user's requirements and extending to the selection of a special semiconductor manufacturing process. A set of customised high voltage integrated driving circuits was developed. High density interconnection problems were solved by the tape automated bonding of semiconductors and a single‐sided two‐layer polymer thick film circuit board. Throughout the assembly process surface‐mounted components and reflow soldering methods were applied to form a large area printed polymer hybrid module. Viable volume production methods for a flat dot‐matrix display could be suggested.

Citation

Aintila, A. and Järvinen, E. (1985), "Packaging of Dot‐matrix Electroluminescent Display Module", Microelectronics International, Vol. 2 No. 2, pp. 14-17. https://doi.org/10.1108/eb044170