Microelectronic Applications for Polymers: Structure‐Property Relationships

Abstract

The design of polymeric materials for microelectronic applications is based on the recognition that structural features in a polymer chain influence the physical properties of the polymer. Illustrations of structure‐property relationships are drawn from applications in lithography, dielectric interlayers and packaging. Among the properties discussed are resolution, plasma etch resistance, thermal stability, electrical properties, permeability, adhesion, mechanical properties and thermal expansion.

Citation

Rooney, J.M. (1984), "Microelectronic Applications for Polymers: Structure‐Property Relationships", Microelectronics International, Vol. 1 No. 4, pp. 32-35. https://doi.org/10.1108/eb044142