Ceramic‐Coated Copper Substrates for Hybrid Circuits

Abstract

Copper substrates covered with ceramic insulating coating were tested for their ability to be used in thick film technology. The ceramic coating was prepared by screen printing from a dielectric composition containing special glass and aluminium oxide and was fired at 820°C–1,000°C. The electrical properties of the coatings studied included voltage breakdown, surface and bulk insulation resistance and dielectric constant. Resistor compositions designed for use on ceramic substrates were screen printed, as on the substrates mentioned, on alumina or ceramic‐coated steel substrates and fired up to the required temperatures (820–875°C). The resistivity and TCR of the prepared resistors were measured in relation to firing temperature. The distribution of lead, bismuth, ruthenium, barium, palladium, silver and copper in the system resistor (or conductor) ceramic coating/copper substrate was investigated. Reference was made to the application of ceramic coatings on copper in other fields, e.g., in heavy‐current electronics.

Citation

Kužel, R., Broukal, J., Bouše, V. and Votruba, Z. (1984), "Ceramic‐Coated Copper Substrates for Hybrid Circuits", Microelectronics International, Vol. 1 No. 4, pp. 4-9. https://doi.org/10.1108/eb044137