Gate Array Packaging—The Forgotten Problem
Article publication date: 1 February 1983
As semi‐custom devices increase in complexity, much time is being devoted to solving the problems of automating their design. The associated problems of packaging are being overlooked. The increasing pin count is becoming a major problem. Surface mount components and hybrid circuits are proposed as a solution.
Silver, N. (1983), "Gate Array Packaging—The Forgotten Problem", Microelectronics International, Vol. 1 No. 2, pp. 35-36. https://doi.org/10.1108/eb044131
MCB UP Ltd
Copyright © 1983, MCB UP Limited