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Thick Film Screen Techniques

C.E. Hargrave (DEK Printing Machines, Weymouth, Dorset, England)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1983



Basic properties of screen materials are defined, with a study of different mesh formations and coatings and their effect on the printed image. Detailed specifications are given for a range of stainless steel, polyester, and nylon fabrics. A table then summarises recommendations for specific thick film applications such as conductor tracks, fine line conductor tracks, resistors, solder paste deposition, dielectric layers, and overglazes. The requirements for the artwork and photopositive are examined, with recommended procedures for exposing and processing the mask. The survey concludes with notes on other factors which commonly influence quality at the print stage.


Hargrave, C.E. (1983), "Thick Film Screen Techniques", Microelectronics International, Vol. 1 No. 2, pp. 21-27.




Copyright © 1983, MCB UP Limited

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