This paper outlines the results of a study (initiated in June 1981) of the optimum packaging and interconnection techniques for a specific electronic sub‐system which was to go into production by the end of the first quarter of 1982. The risks and advantages of using various technologies were investigated and the technology chosen was a compromise between manufacturing cost, risk and time scale.
Spiller, D. (1982), "Complementary Technologies—A Comparison of Electronic Packaging Technologies for Circuit Realisation", Microelectronics International, Vol. 1 No. 1, pp. 47-48. https://doi.org/10.1108/eb044116Download as .RIS
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