Comparative Study of Thick Film Dielectrics

Abstract

Increasing density requirements urge the thick film hybrid manufacturers to print high resolution patterns and to consider the application of multilayer hybrids. The introduction of compact interconnection technologies such as TAB and chip carrier will no doubt accelerate this process. Paste manufacturers are carrying out research to develop inks suited for fine line printing. The properties of dielectric pastes, necessary for multilayer applications, have not been studied so extensively. A programme was initiated to compare various dielectrics in combination with various conductors. From the test programme two tests were found to be most significant for the dielectric's characterisation. These tests, in combination with an SEM‐study of surface and bulk porosity, permitted a quick and reliable selection of an appropriate dielectric paste to be made.

Citation

Vermeirsch, W. (1982), "Comparative Study of Thick Film Dielectrics", Microelectronics International, Vol. 1 No. 1, pp. 11-16. https://doi.org/10.1108/eb044109