Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates

Abstract

A case study was conducted to investigate the issues associated with the design and procurement of flip chip test die and corresponding organic substrates. Test wafers were fabricated by an IC supplier and bumped with electroplated eutectic Sn/Pb by a third party. Issues associated with transferring integrated circuit data to printed circuit design software were identified. The bare and bumped wafers were characterised to identify possible criteria for lot qualification.

Citation

Lau, J., Heydinger, M., Glazer, J. and Uno, D. (1995), "Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates", Circuit World, Vol. 21 No. 3, pp. 20-24. https://doi.org/10.1108/eb044033