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Overview of Tape Automated Bonding Technology

J.H. Lau (Hewlett‐Packard Company, Palo Alto, California, USA)
S.J. Erasmus (Hewlett‐Packard Company, Palo Alto, California, USA)
D.W. Rice (Hewlett‐Packard Company, Palo Alto, California, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1990

219

Abstract

A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.

Citation

Lau, J.H., Erasmus, S.J. and Rice, D.W. (1990), "Overview of Tape Automated Bonding Technology", Circuit World, Vol. 16 No. 2, pp. 5-24. https://doi.org/10.1108/eb044017

Publisher

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MCB UP Ltd

Copyright © 1990, MCB UP Limited

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