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GE Plastics Demonstrate Robotically Controlled Laser Fabrication of Moulded Circuit Boards

P.L. Moran (Advanced Interconnection Ltd)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 1989



The applications team of GE Plastics in Russelsheim near Frankfurt, in common with several other GE groups, has been working in the general field of moulded circuit boards for many years. Recently, however, they have taken the imaginative step of developing a fundamentally new approach to moulded board processing and by working closely with several companies brought the technique to the point where it is possible to add electroplated copper tracking in three dimensions to any suitable moulding made of an appropriate plastic without the need for any additional tooling. In order to launch this technology, GE held a seminar in front of an invited audience in Russelsheim on 25 and 26 January, the earlier date being for German speaking participants and the later English. It is a measure of the interest in this technology that almost all the invitations were taken up and there was standing room only in the lecture theatre. As anybody familiar with moulded circuit boards will be aware, the technology employs skills from several disciplines and considerable congratulations must go to U. Hartman of GE for organising the programme and co‐ordinating the work of the participating companies.


Moran, P.L. (1989), "GE Plastics Demonstrate Robotically Controlled Laser Fabrication of Moulded Circuit Boards", Circuit World, Vol. 15 No. 3, pp. 84-85.




Copyright © 1989, MCB UP Limited

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