Electrophoretic Photoresist Technology: An Image of the Future—Today

Abstract

Line widths are rapidly shrinking and the complexities of boards place increased demands on the resolution capabilities of the photoresists. A new technology is emerging that offers the user unparalleled resolution, a completely aqueous system, and complete, uniform, three‐dimensional coverage of the panel. The unique properties of this system result from the extraordinary method of application of the photoresist. Electrophoresis, or electrocoating, allows the deposition of a very thin, uniform, highly chemically resistant photoresist layer. Any exposed conductive surface, including scratches or other panel imperfections, are coated. The combination of a very thin layer and no cover sheet allows the printing of sub‐mil geometries without the need for a collimated light source. This new application offers the user high yields, both from the chemistry and in circuit yields. Even more so, the resolution capabilities offer opportunities beyond the limitations of dry film and other liquid resists. The photoresist no longer needs to be the gating factor in process capability.

Citation

Vidusek, D.A. (1989), "Electrophoretic Photoresist Technology: An Image of the Future—Today", Circuit World, Vol. 15 No. 2, pp. 6-10. https://doi.org/10.1108/eb043964