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Surface Mount Technology in Japan—From Consumer Electronics to Supercomputer

H. Nakahara (PCK Technology Division, Kollmorgen Corporation, New York, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 1987

59

Abstract

First, a short history of surface mount technology is given, followed by a section describing the current status of surface mount components and the impact of these on printed wiring boards. Then, two essential steps of SMT, component mounting and soldering, as practised in Japan, are discussed. The advantage of additive technology for SMT is briefly reviewed.

Citation

Nakahara, H. (1987), "Surface Mount Technology in Japan—From Consumer Electronics to Supercomputer", Circuit World, Vol. 13 No. 3, pp. 25-28. https://doi.org/10.1108/eb043879

Publisher

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MCB UP Ltd

Copyright © 1987, MCB UP Limited

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