Blowholing in PTH Solder Fillets: Part 5 The Rôle of the Electroless Copper
C. Lea
(National Physical Laboratory, Teddington, Middlesex, England)
F.H. Howie
(National Physical Laboratory, Teddington, Middlesex, England)
56
Abstract
Data from laboratory and production scale tests are given that show that the efficiency of catalyst adsorption controls the coverage by the electroless copper deposit in plated‐through‐holes in FR‐4 laminate, and that this, in turn, governs the outgassing performance of the finished board. The nature of electroless copper nucleation and growth is discussed and the reasons for the formation of voids in the deposit are identified.
Citation
Lea, C. and Howie, F.H. (1986), "Blowholing in PTH Solder Fillets: Part 5 The Rôle of the Electroless Copper", Circuit World, Vol. 13 No. 1, pp. 35-42. https://doi.org/10.1108/eb043854
Publisher
:MCB UP Ltd
Copyright © 1986, MCB UP Limited