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Electrostatic Coating of Photoresists

G. Hultzsch (Kalle Niederlassung der Hoechst AG, Wiesbaden, W. Germany)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 1986



Electrostatic spray coating with liquid photoresists is described. The process takes place in a horizontal coating station especially developed for the printed circuit board. Thin layers as etching as well as thicker layers as solder mask can be applied onto rigid or flexible base materials and metallised glasses or ceramics. The holes are not coated during electrostatic spray coating. In contrast to a curtain or roller coater no reserve pumping or filtration of the primer is necessary. By using a paper conveyor belt the time taken for cleaning is very low when stopping the machine or changing the primer.


Hultzsch, G. (1986), "Electrostatic Coating of Photoresists", Circuit World, Vol. 12 No. 4, pp. 64-67.




Copyright © 1986, MCB UP Limited

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