Troubleshooting in the Electroless Copper Process
Frank E. Stone
(Enthone Inc, Newhaven, Conn., USA.)
45
Abstract
In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the author discusses the factors which can affect the quality and adhesion of electroless copper plating on printed circuit boards and recommends procedures to ensure optimum results.
Citation
Stone, F.E. (1977), "Troubleshooting in the Electroless Copper Process", Circuit World, Vol. 3 No. 2, pp. 14-15. https://doi.org/10.1108/eb043551
Publisher
:MCB UP Ltd
Copyright © 1977, MCB UP Limited