Gold Plating of Printed Circuit Boards and Wire: Plating Techniques for Ultrasonic Bonding
Leo Missel
(International Business Machines Corp., General Products Div., San Jose, California, U.S.A.)
65
Abstract
In this paper, reproduced by permission of “Metal Finishing” (New Jersey), the author enumerates the required properties of electroplated gold coatings on printed circuit boards and wire to ensure satisfactory bonding by ultrasonic means. The gold plating procedures and process control methods which are necessary to produce coatings yielding consistently high bond strengths are described.
Citation
Missel, L. (1976), "Gold Plating of Printed Circuit Boards and Wire: Plating Techniques for Ultrasonic Bonding", Circuit World, Vol. 3 No. 1, pp. 17-23. https://doi.org/10.1108/eb043544
Publisher
:MCB UP Ltd
Copyright © 1976, MCB UP Limited