In this paper a review is given of the more commonly employed organic polymers for coating and embedment of electronic modules. Following discussion of the basic types and their properties, problems arising from emission of volatiles from encapsulants are outlined and the importance of considering these in early design stages is stressed.
MacLeod Ross, W. (1976), "The Uses of Organic Polymers in Electronics Packaging with Particular References to Printed Circuit Modules", Circuit World, Vol. 2 No. 3, pp. 30-36. https://doi.org/10.1108/eb043538Download as .RIS
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