Hot‐bar Soldering of TAB Components with 0.150 mm OLB Pitch

Abstract

Tape automated bonding (TAB) is a powerful technique for connecting fine‐pitch integrated components to the corresponding substrates. This paper describes the specific example of hot‐bar soldering TAB components with an outer lead bonding (OLB) pitch of 0.150 mm to FR‐4 printed wiring boards. The prerequisites to be taken into account, the outer lead bonding process parameters, the hot‐bar soldering results and recommendations are presented.

Citation

Mödl, A. (1994), "Hot‐bar Soldering of TAB Components with 0.150 mm OLB Pitch", Soldering & Surface Mount Technology, Vol. 6 No. 3, pp. 29-32. https://doi.org/10.1108/eb037877