Life Prediction of SMT Solder Joints under Thermal Cycling
J.H. Huang
(University of Science and Technology Beijing, Beijing, China)
J.Y. Pei
(Hualin Rubber Institute for Staff and Workers, Mudanjiang, China)
Y.Y. Qian
(Harbin Institute of Technology, Harbin, China)
Y.H. Jiang
(Harbin Institute of Technology, Harbin, China)
43
Abstract
In this paper, a formula for life prediction of SMT solder joints under thermal cycling has been established on a damage model. The major failure mechanisms such as fatigue, creep and atmospheric oxidation have been considered in the formula. The experimental verification shows that the life formula established in this paper coincides with the experimental results.
Citation
Huang, J.H., Pei, J.Y., Qian, Y.Y. and Jiang, Y.H. (1994), "Life Prediction of SMT Solder Joints under Thermal Cycling", Soldering & Surface Mount Technology, Vol. 6 No. 1, pp. 31-50. https://doi.org/10.1108/eb037853
Publisher
:MCB UP Ltd
Copyright © 1994, MCB UP Limited