Numerical Analysis of the Ball Forming Process in Copper Ball Bonding
F. Hongyuan
(Harbin Institute of Technology, Harbin, People's Republic of China)
Q. Yiyu
(Harbin Institute of Technology, Harbin, People's Republic of China)
J. Yihong
(Harbin Institute of Technology, Harbin, People's Republic of China)
24
Abstract
In this paper, the process of forming copper wire balls in copper ball bonding has been studied by numerical analysis. By calculating the temperature field, speed field and displacement field for ultra‐fine copper wire under a miniarc, a regular pattern of copper wire ball formation has been observed. The calculation results for the displacement field has also been tested and verified.
Citation
Hongyuan, F., Yiyu, Q. and Yihong, J. (1993), "Numerical Analysis of the Ball Forming Process in Copper Ball Bonding", Soldering & Surface Mount Technology, Vol. 5 No. 3, pp. 50-52. https://doi.org/10.1108/eb037840
Publisher
:MCB UP Ltd
Copyright © 1993, MCB UP Limited