Creep of 96.5Sn3.5Ag Solder Interconnects

Abstract

An exact analysis is presented for the creep deformation of solder interconnects subjected to the actions of bending moment, twisting moment and axial force. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, axial force, bending moment, twisting moment, bending stress, shearing stress, curvature rate and twist rate are also provided for engineering practice convenience. The constitutive relationship of the 96.5Sn3.5Ag solder interconnects is described by the Garofalo‐Arrhenius steady‐state creep equation.

Citation

Lau, J.H. (1993), "Creep of 96.5Sn3.5Ag Solder Interconnects", Soldering & Surface Mount Technology, Vol. 5 No. 3, pp. 45-52. https://doi.org/10.1108/eb037839