TY  - JOUR
AB  - This conference was the second in the National Physical Laboratory series focusing in turn on each of the non‐CFC options for de‐fluxing soldered electronics assemblies. The first conference was on Controlled Atmosphere Soldering and the third will be on New Solvents.
VL  - 4
IS  - 3
SN  - 0954-0911
DO  - 10.1108/eb037803
UR  - https://doi.org/10.1108/eb037803
AU  - Lea Colin
AU  - Willis Bob
AU  - Judd Mike
AU  - Willis Bob
AU  - Beamish John
AU  - Moore Karen
PY  - 1992
Y1  - 1992/01/01
TI  - SMART group news
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 55
EP  - 61
Y2  - 2024/04/19
ER  -