To read this content please select one of the options below:

The Relationship of Component Solderability Testing to Board‐level Soldering Performance

M.A. Kwoka (Harris Semiconductor, Melbourne, Florida, USA)
P.D. Mullenix (Harris Semiconductor, Melbourne, Florida, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1992



Visual inspection remains the dominant method of assessing component lead solderability and finished board solder joint quality. In recent years the wetting balance has received much attention as an attractive alternative to the inherently subjective visual inspection method of assessing component termination solderability. Whether direct visual inspection or wetting balance methods are used, the method can be shown to be effective only if the results are in agreement with board‐level soldering performance. This paper addresses the issue of the agreement of visual board‐level solder joint quality with both visual ‘dip and look’ solderability assessment and wetting balance measurement of the components prior to board assembly. A description of visual ‘dip and look’ solderability test assessment and of wetting balance methodology for components is presented, and a compendium of wetting balance tests and indices are documented in the Appendix. The experimental strategy employed is outlined, and details of the experimental technique (including the equipment, materials and component sample preparations) are provided. The experimental results present a comparison of both ‘dip and look’ visual solderability assessment and wetting balance measures with regard to actual board‐level soldering performance. The ability of the various assessment methods to predict board level defects is also explored.


Kwoka, M.A. and Mullenix, P.D. (1992), "The Relationship of Component Solderability Testing to Board‐level Soldering Performance", Soldering & Surface Mount Technology, Vol. 4 No. 3, pp. 5-11.




Copyright © 1992, MCB UP Limited

Related articles