Stress Analysis of Component Attachments to Printed Circuit Boards

Abstract

During the insertion of pin‐in‐hole (PIH) components in a printed circuit board (PCB), adhesively bonded and/or soldered surface mount components (SMCs) already on the board experience mechanical stress. This paper describes the results of a study investigating the forces induced in the adhesive bond and the surface mounts during the insertion of dual inline package (DIP) components. The failure criteria for the glue bonds as well as the gullwing leads were determined from experimental strength tests. The forces in the glue and in the leads were calculated by a combination of analytical and finite element methods. It was found that the adhesive bond as well as the soldered gullwing lead would not fail under the forces induced in the insertion operation.

Citation

Prakash, V., Engel, P.A., Pitarresi, J.M., Albert, T. and Westby, G. (1992), "Stress Analysis of Component Attachments to Printed Circuit Boards", Soldering & Surface Mount Technology, Vol. 4 No. 2, pp. 18-21. https://doi.org/10.1108/eb037788