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A Study of the Mechanical Behaviour of SnPb Solders using Viscoelasticity Theory

J.H. Huang (University of Science and Technology, Beijing, China)
Y.H. Jiang (University of Science and Technology, Beijing, China)
Y.Y. Qian (Harbin Institute of Technology, Harbin, China)
Q.L. Wang (Harbin Institute of Technology, Harbin, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1992

Abstract

This paper presents a viscoelastic model for analysing the mechanical behaviour of SnPb solders which has been developed by combining grain boundary slip with viscoelasticity theory. On the basis of the model, and by using Boltzmann's integral constitutive equation of viscoelasticity, the mechanical behaviour (i.e., the relationships between stress (load) and strain (displacement)) of SnPb solders for one‐dimensional shearing deformation has been investigated and experimentally verified.

Citation

Huang, J.H., Jiang, Y.H., Qian, Y.Y. and Wang, Q.L. (1992), "A Study of the Mechanical Behaviour of SnPb Solders using Viscoelasticity Theory", Soldering & Surface Mount Technology, Vol. 4 No. 2, pp. 10-12. https://doi.org/10.1108/eb037786

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited