TY - JOUR AB - An installation has been developed for carrying out thermal cycling experiments on soldered SMT joints. Using this thermal cycle installation (which was developed by the authors) and a simulated chip carrier, study has been made of the influence of various factors on the reliability of soldered SMT joints during thermal cycling. These factors include the position of the soldered joint, the temperature range of the thermal cycle, the dwell time, etc. VL - 4 IS - 2 SN - 0954-0911 DO - 10.1108/eb037785 UR - https://doi.org/10.1108/eb037785 AU - Huang J.H. AU - Gao W. AU - Jian Y.Y. AU - Jiang Y.H. PY - 1992 Y1 - 1992/01/01 TI - A Study of the Failure of Soldered SMT Joints during Thermal Cycling T2 - Soldering & Surface Mount Technology PB - MCB UP Ltd SP - 7 EP - 9 Y2 - 2024/03/29 ER -