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Water‐rinsable or so‐called ‘No Clean’ Solder Pastes? The Attempt of a Comparison from the Technical and Environmental Viewpoint

W. Leske (Demetron GmbH, Hanau, Germany)
J. Koch (Degussa AG, Hanau, Germany)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1992

Abstract

In SMD as well as in hybrid manufacturing processes, considerable quantities of CFC are still being used in 1991 for the cleaning of component groups. The second BlmSchV, as amended, (status at 12 December 1990), prohibits the use of R‐113 for surface treatment plants as of 31 December 1992. Pursuant to developments in solder pastes, some products are already available which render the use of CFCs superfluous. Two methods in particular are emerging, which work either completely without cleaning or use water as a cleaning medium. A critical comparison is made of the properties of the relevant solder pastes in these categories.

Citation

Leske, W. and Koch, J. (1992), "Water‐rinsable or so‐called ‘No Clean’ Solder Pastes? The Attempt of a Comparison from the Technical and Environmental Viewpoint", Soldering & Surface Mount Technology, Vol. 4 No. 1, pp. 42-44. https://doi.org/10.1108/eb037778

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited