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Analysis of the Ball‐forming Process in Copper Ball Bonding

F. Hongyuan (Harbin Institute of Technology, People's Republic of China)
Q. Yiyu (Harbin Institute of Technology, People's Republic of China)
J. Yihong (Harbin Institute of Technology, People's Republic of China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1992

Abstract

Pulse control, SEM analysis and metallographic examination have been used to record and study the process by which a ball is formed at the tip of an ultra‐fine copper wire. The process by which the copper ball is formed, and the laws governing this process, are presented.

Citation

Hongyuan, F., Yiyu, Q. and Yihong, J. (1992), "Analysis of the Ball‐forming Process in Copper Ball Bonding", Soldering & Surface Mount Technology, Vol. 4 No. 1, pp. 14-16. https://doi.org/10.1108/eb037774

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited