Analysis of the Ball‐forming Process in Copper Ball Bonding
Soldering & Surface Mount Technology
Article publication date: 1 January 1992
Pulse control, SEM analysis and metallographic examination have been used to record and study the process by which a ball is formed at the tip of an ultra‐fine copper wire. The process by which the copper ball is formed, and the laws governing this process, are presented.
Hongyuan, F., Yiyu, Q. and Yihong, J. (1992), "Analysis of the Ball‐forming Process in Copper Ball Bonding", Soldering & Surface Mount Technology, Vol. 4 No. 1, pp. 14-16. https://doi.org/10.1108/eb037774
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