New Products

Abstract

Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. × 18 in. to 4 in. × 4 in. and assembling a wide range of components from 0402 chips to 52‐pin PLCCs. Its contact‐free, vision centring system, featuring 64 level grey‐scale processing, permits placement of components to 0·787 in. with 20 mil lead spacing.

Citation

(1991), "New Products", Soldering & Surface Mount Technology, Vol. 3 No. 3, pp. 60-61. https://doi.org/10.1108/eb037771