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Microstructural and Mechanical Characterisation of 43/43/14 Tin/Lead/Bismuth

J.L. Marshall (Center for Materials Characterization, University of North Texas, Denton, USA)
J. Calderon (Center for Materials Characterization, University of North Texas, Denton, USA)
J. Sees (Center for Materials Characterization, University of North Texas, Denton, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1991

Abstract

A mechanical and microstructural study was performed of 43/43/14 tin/lead/bismuth solder. This alloy melts lower than the commonly used tin/lead solders and therefore holds promise as a useful material in two‐step soldering processes or in processes with thermally sensitive components. Mechanical testing of 43/43/14 tin/lead/bismuth showed a strength comparable to that of tin/lead solders but increased creep rate. Microstructural analysis (scanning electron microscopy/energy dispersive X‐ray) exhibited the same mechanism of fatigue as for tin/lead solders, viz., heterogeneous coarsening. Thermocyclic fatigue demonstrated that the long‐term reliability of 43/43/14 tin/lead/bismuth is comparable to that of tin/lead solders.

Citation

Marshall, J.L., Calderon, J. and Sees, J. (1991), "Microstructural and Mechanical Characterisation of 43/43/14 Tin/Lead/Bismuth", Soldering & Surface Mount Technology, Vol. 3 No. 3, pp. 25-33. https://doi.org/10.1108/eb037766

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited