Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards
K. Lindner
(Weld‐Equip Deutschland GmbH, Munich, Germany)
T. Reinders
(Weld‐Equip Sales BV, Helmond, The Netherlands)
36
Abstract
Outer lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering process is critical if one does not closely monitor all parameters. This article describes some of the most important parameters of the precision reflow soldering process for TABs and flatpacks.
Citation
Lindner, K. and Reinders, T. (1991), "Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards", Soldering & Surface Mount Technology, Vol. 3 No. 3, pp. 4-7. https://doi.org/10.1108/eb037761
Publisher
:MCB UP Ltd
Copyright © 1991, MCB UP Limited