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Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards

K. Lindner (Weld‐Equip Deutschland GmbH, Munich, Germany)
T. Reinders (Weld‐Equip Sales BV, Helmond, The Netherlands)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1991

Abstract

Outer lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering process is critical if one does not closely monitor all parameters. This article describes some of the most important parameters of the precision reflow soldering process for TABs and flatpacks.

Citation

Lindner, K. and Reinders, T. (1991), "Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards", Soldering & Surface Mount Technology, Vol. 3 No. 3, pp. 4-7. https://doi.org/10.1108/eb037761

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited