Outer lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering process is critical if one does not closely monitor all parameters. This article describes some of the most important parameters of the precision reflow soldering process for TABs and flatpacks.
Lindner, K. and Reinders, T. (1991), "Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards", Soldering & Surface Mount Technology, Vol. 3 No. 3, pp. 4-7. https://doi.org/10.1108/eb037761
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