TY  - JOUR
AB  - The programme will cover various aspects of high technology joining processes ranging from soldering and brazing to diffusion and adhesive bonding. The papers presented will cover the latest developments in production techniques, methods of enhancing quality, joint inspection, new or improved materials, design/properties of joints and long‐term reliability.
VL  - 3
IS  - 2
SN  - 0954-0911
DO  - 10.1108/eb037757
UR  - https://doi.org/10.1108/eb037757
AU  - Shackleford R.A.
PY  - 1991
Y1  - 1991/01/01
TI  - International association news
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 63
EP  - 65
Y2  - 2024/04/25
ER  -