International association news

Abstract

The programme will cover various aspects of high technology joining processes ranging from soldering and brazing to diffusion and adhesive bonding. The papers presented will cover the latest developments in production techniques, methods of enhancing quality, joint inspection, new or improved materials, design/properties of joints and long‐term reliability.

Citation

Shackleford, R.A. (1991), "International association news", Soldering & Surface Mount Technology, Vol. 3 No. 2, pp. 63-65. https://doi.org/10.1108/eb037757