TY  - JOUR
AB  - Solder has been the primary method of component attachment since the early days of radio. This tradition carries with it an overhead which becomes increasingly expensive as the degree of miniaturisation increases. Solderless interconnect methods, however, are often overlooked or unfairly discounted as unreliable. Surprisingly, solderless connections can be mechanically superior to and environmentally more robust than their soldered peers. This paper reviews various solderless interconnect techniques for surface mount applications and discusses their relative merits.
VL  - 3
IS  - 2
SN  - 0954-0911
DO  - 10.1108/eb037750
UR  - https://doi.org/10.1108/eb037750
AU  - Bourdelaise R.A.
PY  - 1991
Y1  - 1991/01/01
TI  - Solderless Alternatives to Surface Mount Component Attachment
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 13
EP  - 23
Y2  - 2024/04/25
ER  -