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Quantitative Solderability Measurement of Electronic Components: Part 6: An Inter‐laboratory Comparison of Wetting Balance Measurements

C. Lea (National Physical Laboratory, Teddington, Middlesex, England)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1991

Abstract

The three European Community manufacturers of commercially available wetting balances for measuring the solderability of electronic components have participated in an intercomparison assessment of surfaces of standard solderability that have the potential for calibrating the balance instruments. The development of the standard surfaces, as well as the small adjustments needed to improve the uniformity of design of the different instruments, and the standardisation of the procedures for their use, have been described in the preceding papers in this series. This paper gives details of the experimental procedures used for the intercomparison and the significance of the comparative data from each balance type.

Citation

Lea, C. (1991), "Quantitative Solderability Measurement of Electronic Components: Part 6: An Inter‐laboratory Comparison of Wetting Balance Measurements", Soldering & Surface Mount Technology, Vol. 3 No. 2, pp. 4-12. https://doi.org/10.1108/eb037749

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited