International association news

Abstract

Although the subject discussed at this meeting is one in which I have a personal and commercial interest, I will try to report the meeting in an unbiased manner. I must, however, point out that I asked only one question at the meeting and that was when one of the speakers compared solder cream to sand. I believe this type of comment shows a complete misunderstanding of the sophisticated material that is today's solder cream and especially of solder cream designed for ‘fine‐pitch soldering’.

Citation

(1991), "International association news", Soldering & Surface Mount Technology, Vol. 3 No. 1, pp. 67-69. https://doi.org/10.1108/eb037746