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Impurities in Solder—Their Impact on Solderability and Corrosion

G. Becker (Ericsson Radio Systems AB, Stockholm, Sweden)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1991

Abstract

German silver was tinned at three temperatures with solder containing 17 different impurities at up to five different concentration levels. The tinning process was carried out in a wetting balance. After this, the samples were subjected to corrosion and tested in a wetting balance again. It was established that bismuth at high concentration levels has a corrosion resistant effect which gives superior solderability. Silver, aluminium, bismuth, cadmium and copper, in amounts accepted by specifications, make the tinned surface unsolderable after corrosion. Statistical evaluation of a large number of tests — 1755 tests with 21,060 evaluated points — gave valuable information on how a wetting balance curve should be evaluated and which criteria should be established for good soldering.

Citation

Becker, G. (1991), "Impurities in Solder—Their Impact on Solderability and Corrosion", Soldering & Surface Mount Technology, Vol. 3 No. 1, pp. 24-33. https://doi.org/10.1108/eb037742

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited