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Quantitative Solderability Measurement of Electronic Components: Part 5: Wetting Balance Instrumental Parameters and Procedures

C. Lea (National Physical Laboratory, Teddington, Middlesex, England)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1991

Abstract

The wetting balance has been identified as a technique suitable for the establishment of a quantitative basis for the measurement of the solderability of electronic components. This paper deals with those parameters of the instrument and those procedures of the measurement that fall within the choice of the operator. It is important to know the amount of attention that must be paid to each parameter to achieve the precision required.

Citation

Lea, C. (1991), "Quantitative Solderability Measurement of Electronic Components: Part 5: Wetting Balance Instrumental Parameters and Procedures", Soldering & Surface Mount Technology, Vol. 3 No. 1, pp. 10-13. https://doi.org/10.1108/eb037739

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited