Quantitative Solderability Measurement of Electronic Components: Part 4: Wetting Balance Instrument Thermal Design

Abstract

The wetting balance is being used as the focal point to establish a quantitative measurement capability for solderability of electronic components of all configurations. This paper considers the factors influencing solderability measurement that arise directly from the thermal design and construction materials of the wetting balance instrument. The work is illustrated by the differences between the three commercial wetting balances currently manufactured within the European Community.

Citation

Lea, C. (1990), "Quantitative Solderability Measurement of Electronic Components: Part 4: Wetting Balance Instrument Thermal Design", Soldering & Surface Mount Technology, Vol. 2 No. 3, pp. 4-9. https://doi.org/10.1108/eb037728