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Reliability of Soldered Joints: A Description of the State of the Art: Part 2

E.E. de Kluizenaar (SMD Technology Centre of Philips Centre For manufacturing Technology, Eindhoven, The Netherlands)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1990

26

Abstract

In Part 1, background information on mechanical properties and metallurgy of solder alloys and soldered joints has been presented. In this part, mechanisms of damage and degradation of components and soldered joints during soldering, during transport, and during field life are discussed. Thermal shock damage of components and excessive dissolution of metallisations are the major effects during soldering. During transport, fatigue of leads and fracture may be caused by vibration and mechanical shocks respectively. During field life, degradation is governed primarily by low cycle fatigue of the solder and incidentally also by formation of intermetallic diffusion layers between solder and base metals. This article contains an extended illustration of solder fatigue of joints on a variety of component and board types. Finally, the influence of the variety of soldered constructions in electronic circuits on solder fatigue is discussed.

Citation

de Kluizenaar, E.E. (1990), "Reliability of Soldered Joints: A Description of the State of the Art: Part 2", Soldering & Surface Mount Technology, Vol. 2 No. 2, pp. 56-66. https://doi.org/10.1108/eb037720

Publisher

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MCB UP Ltd

Copyright © 1990, MCB UP Limited

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